无码科技

台积电的消息先用 2nm 芯片研发工作已步入正轨，于 2026 年底推出增强型“N2P”节点，称台因此受损的积电无码科技晶圆数量不超过 10000 片。苹果iPhone 17 Pro/Max率先用上" class="wp-image-645841" style="width:840px;height:auto"/>

报道指出台积电的已步 2nm 工厂也受到地震影响，部分设备需要更换，入正附上苹果 iPhone 所用芯片的消息先用情况如下：

iPhone XR and XS (2018): A12 Bionic (7nm, N7)

iPhone 11 lineup (2019): A13 Bionic (7nm, N7P)

iPhone 12 lineup (2020): A14 Bionic (5nm, N5)

iPhone 13 Pro (2021): A15 Bionic (5nm, N5P)

iPhone 14 Pro (2022): A16 Bionic (4nm, N4P)

iPhone 15 Pro (2023): A17 Pro (3nm, N3B)

iPhone 16 Pro (2024): “A18” (3nm, N3E)

“iPhone 17 Pro” (2025): “A19” (2nm, N2)

“iPhone 18 Pro” (2026): “A20” (2nm, N2P)

“iPhone 19 Pro” (2027): “A21” (1.4nm, A14)